WISFAC
Wafer Inspection Equipment System
Various wafer defects can be detected during the wafer process.
We continue to increase the probability of defect detection by applying superior defect detection algorithms.
1. Air Pocket Inspection
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IIM-3020 ｜ IIM-3010 ｜ IIM-2010
2. Edge/Surface Inspection
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ESIS-3000 ｜ EIS-3000
3. Other
Learn more3-1. Final Sorter
Invert wafers by applying 8 Load Port, 7 Load Port-1F, 4/2 Load Port IWS-3000-8L (8 Load Port) and IWS-3000-7L1F (1 flip-per out of 7 Load Port) inverting robots. Open Cassette, FOSB, and FOUP are all available, and the carrier types (Open, FOSB, and FOUP) used can be automatically distinguished as follows Prevent operator error.
IWS-3000(8Load Port) ｜ IWS-3000(7Load Port 1Flipper) ｜ IMS-3000(4Load Port) ｜ IMS-3000(2Load Port)
3-2. Cu-haze, Edge/DSOD, Edge/Cu-haze
The CHAC-3000, EDIS-3000, and ECIS-3000 are equipment for detecting Si Wafer's Edge defects and Surface Patterns Crystal Originated Pits (COP), and haze pattern.
CHAC-3000 ｜ EDIS-3000 ｜ ECIS-3000