By applying a outstanding defect detection algorithm, defects such as bumps and penetration holes that may occur during wafer production can be detected at the same time in addition to air pockets.
Using a precision optical system, the pixel resolution of the image is improved, and a number of high-level image processing algorithms are applied to implement an ultra-precision detection system that can detect even small defects with a diameter of 20㎛.
The detected images are automatically classified into defect types by an automatic defect determination algorithm, and a positive/negative determination is performed automatically.
ADEC(Automatic Defect Classification) algorithms provide a high level of reliability by applying good pattern recognition algorithms.