The IIM-2010 is a device that detects all defects in a 200mm Si wafer and measures the size of each defect. The following are the types of faults IIM-2010 can detect.
Through defect detection and classification algorithms such as Buried Air-Pocket, Surface Bump, and Through Hole, Users can easily detect all defects in various Si wafers(N-, N+, N++, P-, P+, P++) with high throughput.
Non-metallic materials are used in wafer contact areas to prevent wafer contamination.