During Si Wafer production process, problems may occur due to defects such as chip, crack, and contamination of edge/surface.
As such, detecting and classifying Si Wafer's Edge/Surface defects is becoming one of the most important things in the Si Wafer manufacturing process.
WISFAC's ESIS-3000 can automatically detect and classify Edge/Surface faults.
Defects can be handled with high precision and reliability such as Chip, Crack, Sparkle, and Stain.
In particular, we provide fully automated vision calibration function by specially designing cameras, lighting
This ensures that the ESIS-3000 is always in optimal condition and operational.