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IIM-3020


The IIM-3020 is a device that detects all defects in a 300mm Si wafer and measures the size of each defect. The following are the types of faults the IIM-3020 can detect.
Through defect detection and classification algorithms such as Buried Air-Pocket, Surface Bump, and Through Hole, Users can easily detect all defects in various Si wafers(N-, N+, N++, P-, P+, P++) with high throughput.
Non-metallic materials are used in wafer contact areas to prevent wafer contamination.

제품 이미지 및 사양

Target Wafer Φ 300mm Si Wafer (Polished, Etched)
P-, P+, P++, N-, N+, N++
Detectable Defects Buried Air-pocket, Surface Bump
Through-Hole
Min. detectable Airpocket ≥ 8㎛ (Double Side Polished Wafer)
Capture Rate: 95 % for APK (≥ 8㎛ diameter)
Defect Information Diameter, Long-Short Ratio
Circularity X, Y, Z coordinate
(Z means the depth of defect)
Throughput 165 Wfrs/h (in case of no defect in Wafer)
Dimension(mm) 1450(W) X 2380(D) X 2010(H)

제품 상세 이미지 및 추가설명

Detail view