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IWS-3000


The IWS-3000 is a device that moves 300mm wafers between carriers. If necessary, the wafer can be inverted by applying the inverting robot.
Open Cassette, FOSB, and FOUP are all available, and you can automatically distinguish the types of carriers (Open, FOSB, and FOUP) you use to prevent workers from making mistakes.

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IWS-3000-8L(8Load Port) | IWS-3000-7L1F(7Load Port 1Flipper)

Wafer Diameter 300㎜ ± 0.2㎜
Wafer Thickness 775㎛ ± 20㎛
Warp 100㎛ Max
Notch Depth 1.00 ~ 1.25㎜
Wafer Type ETCHED, DSP, EPI, CVD
Cover Material Stainless Steel
Dimension(mm) 2700 x 1900 x 2100 (㎜)

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Detail view