介绍制品
IIM-2010
| Target Wafer | Φ 200mm Si Wafer (Polished, Etched) |
|---|---|
| N, P-, P+, P++ | |
| Detectable Defects | Buried Air-pocket, Surface Bump |
| Through-Hole | |
| Min. detectable Airpocket | ≥ 10㎛ (Double Side Polished Wafer) |
| Capture Rate: 95 % for APK (≥ 25㎛ diameter) | |
| Defect Information | Diameter, Long-Short Ratio |
| Circularity X, Y, Z coordinate | |
| (Z means the depth of defect) | |
| Throughput | 180 Wfrs/h (in case of no defect in Wafer) |
| Dimension(mm) | 1457(W) X 1980(D) X 1912(H) |
Air Pocket(IR) 整体视图